Virtualized link states of multiple protocol layer package interconnects

ABSTRACT

Systems, methods, and devices can include a first die comprising a first arbitration and multiplexing logic, a first protocol stack associated with a first interconnect protocol, and a second protocol stack associated with a second interconnect protocol. A second die comprising a second arbitration and multiplexing logic. A multilane link connects the first die to the second die. The second arbitration and multiplexing logic can send a request to the first arbitration and multiplexing logic to change a first virtual link state associated with the first protocol stack. The first arbitration and multiplexing logic can receive, from across the multilane link, the request from the first die indicating a request to change the first virtual link state; determine that the first interconnect protocol is ready to change a physical link state; and change the first virtual link state according to the received request while maintaining a second virtual link state.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of (and claims the benefit ofpriority under 35 U.S.C. § 120) of U.S. application Ser. No. 16/373,472,filed Apr. 2, 2019, and entitled VIRTUALIZED LINK STATES OF MULTIPLEPROTOCOL LAYER PACKAGE INTERCONNECTS. The disclosure of the priorapplication is considered part of and is hereby incorporated byreference in its entirety in the disclosure of this application.

BACKGROUND

Interconnects can be used to provide communication between differentdevices within a system, some type of interconnect mechanism is used.One typical communication protocol for communications interconnectsbetween devices in a computer system is a Peripheral ComponentInterconnect Express (PCI Express™ (PCIe™)) communication protocol. Thiscommunication protocol is one example of a load/store input/output (I/O)interconnect system. The communication between the devices is typicallyperformed serially according to this protocol at very high speeds.

Devices can be connected across various numbers of data links, each datalink including a plurality of data lanes. Upstream devices anddownstream devices undergo link training upon initialization to optimizedata transmissions across the various links and lanes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an embodiment of a block diagram for a computingsystem including a multicore processor.

FIG. 2 is a schematic diagram of an example R-Link interconnecting twodies in accordance with embodiments of the present disclosure.

FIG. 3 is a simplified block diagram of a Multichip Package Link (MCPL)in accordance with embodiments of the present disclosure.

FIG. 4 is a simplified block diagram of an Multichip Package Link (MCPL)interfacing with upper layer logic of multiple protocols using a logicalPHY interface (LPIF) in accordance with embodiments of the presentdisclosure.

FIG. 5 is a schematic diagram illustrating a Multichip Package Link(MCPL) illustrating example locations of Physical Link State Machinesand Virtual Link State Machines in accordance with embodiments of thepresent disclosure.

FIG. 6 is a schematic diagram of an example physical layer packet (PLP)format in accordance with embodiments of the present disclosure.

FIG. 7 is a swim lane diagram illustrating example message flows forchanging virtual and physical link states from an active state to anidle state in accordance with embodiments of the present disclosure.

FIGS. 8A-8C are schematic diagrams illustrating a Multichip Package Link(MCPL) illustrating message flow pathways in accordance with embodimentsof the present disclosure.

FIG. 9 illustrates an embodiment of a computing system including aninterconnect architecture.

FIG. 10 illustrates an embodiment of a interconnect architectureincluding a layered stack.

FIG. 11 illustrates an embodiment of a request or packet to be generatedor received within an interconnect architecture.

FIG. 12 illustrates an embodiment of a transmitter and receiver pair foran interconnect architecture.

FIG. 13 illustrates another embodiment of a block diagram for acomputing system including a processor.

FIG. 14 illustrates an embodiment of a block for a computing systemincluding multiple processor sockets.

FIG. 15 is a diagram illustrating an example link training statemachine.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth,such as examples of specific types of processors and systemconfigurations, specific hardware structures, specific architectural andmicro architectural details, specific register configurations, specificinstruction types, specific system components, specificmeasurements/heights, specific processor pipeline stages and operationetc. in order to provide a thorough understanding of the presentdisclosure. It will be apparent, however, to one skilled in the art thatthese specific details need not be employed to practice the presentdisclosure. In other instances, well known components or methods, suchas specific and alternative processor architectures, specific logiccircuits/code for described algorithms, specific firmware code, specificinterconnect operation, specific logic configurations, specificmanufacturing techniques and materials, specific compilerimplementations, specific expression of algorithms in code, specificpower down and gating techniques/logic and other specific operationaldetails of computer system have not been described in detail in order toavoid unnecessarily obscuring the present disclosure.

Although the following embodiments may be described with reference toenergy conservation and energy efficiency in specific integratedcircuits, such as in computing platforms or microprocessors, otherembodiments are applicable to other types of integrated circuits andlogic devices. Similar techniques and teachings of embodiments describedherein may be applied to other types of circuits or semiconductordevices that may also benefit from better energy efficiency and energyconservation. For example, the disclosed embodiments are not limited todesktop computer systems or Ultrabooks™. And may be also used in otherdevices, such as handheld devices, tablets, other thin notebooks,systems on a chip (SOC) devices, and embedded applications. Someexamples of handheld devices include cellular phones, Internet protocoldevices, digital cameras, personal digital assistants (PDAs), andhandheld PCs. Embedded applications typically include a microcontroller,a digital signal processor (DSP), a system on a chip, network computers(NetPC), set-top boxes, network hubs, wide area network (WAN) switches,or any other system that can perform the functions and operations taughtbelow. Moreover, the apparatus', methods, and systems described hereinare not limited to physical computing devices, but may also relate tosoftware optimizations for energy conservation and efficiency. As willbecome readily apparent in the description below, the embodiments ofmethods, apparatus', and systems described herein (whether in referenceto hardware, firmware, software, or a combination thereof) are vital toa ‘green technology’ future balanced with performance considerations.

As computing systems are advancing, the components therein are becomingmore complex. As a result, the interconnect architecture to couple andcommunicate between the components is also increasing in complexity toensure bandwidth requirements are met for optimal component operation.Furthermore, different market segments demand different aspects ofinterconnect architectures to suit the market's needs. For example,servers require higher performance, while the mobile ecosystem issometimes able to sacrifice overall performance for power savings. Yet,it is a singular purpose of most fabrics to provide highest possibleperformance with maximum power saving. Below, a number of interconnectsare discussed, which would potentially benefit from aspects of thedisclosure described herein.

Referring to FIG. 1, an embodiment of a block diagram for a computingsystem including a multicore processor is depicted. Processor 100includes any processor or processing device, such as a microprocessor,an embedded processor, a digital signal processor (DSP), a networkprocessor, a handheld processor, an application processor, aco-processor, a system on a chip (SOC), or other device to execute code.Processor 100, in one embodiment, includes at least two cores—core 101and 102, which may include asymmetric cores or symmetric cores (theillustrated embodiment). However, processor 100 may include any numberof processing elements that may be symmetric or asymmetric.

In one embodiment, a processing element refers to hardware or logic tosupport a software thread. Examples of hardware processing elementsinclude: a thread unit, a thread slot, a thread, a process unit, acontext, a context unit, a logical processor, a hardware thread, a core,and/or any other element, which is capable of holding a state for aprocessor, such as an execution state or architectural state. In otherwords, a processing element, in one embodiment, refers to any hardwarecapable of being independently associated with code, such as a softwarethread, operating system, application, or other code. A physicalprocessor (or processor socket) typically refers to an integratedcircuit, which potentially includes any number of other processingelements, such as cores or hardware threads.

A core often refers to logic located on an integrated circuit capable ofmaintaining an independent architectural state, wherein eachindependently maintained architectural state is associated with at leastsome dedicated execution resources. In contrast to cores, a hardwarethread typically refers to any logic located on an integrated circuitcapable of maintaining an independent architectural state, wherein theindependently maintained architectural states share access to executionresources. As can be seen, when certain resources are shared and othersare dedicated to an architectural state, the line between thenomenclature of a hardware thread and core overlaps. Yet often, a coreand a hardware thread are viewed by an operating system as individuallogical processors, where the operating system is able to individuallyschedule operations on each logical processor.

Physical processor 100, as illustrated in FIG. 1, includes twocores—core 101 and 102. Here, core 101 and 102 are considered symmetriccores, i.e. cores with the same configurations, functional units, and/orlogic. In another embodiment, core 101 includes an out-of-orderprocessor core, while core 102 includes an in-order processor core.However, cores 101 and 102 may be individually selected from any type ofcore, such as a native core, a software managed core, a core adapted toexecute a native Instruction Set Architecture (ISA), a core adapted toexecute a translated Instruction Set Architecture (ISA), a co-designedcore, or other known core. In a heterogeneous core environment (i.e.asymmetric cores), some form of translation, such a binary translation,may be utilized to schedule or execute code on one or both cores. Yet tofurther the discussion, the functional units illustrated in core 101 aredescribed in further detail below, as the units in core 102 operate in asimilar manner in the depicted embodiment.

As depicted, core 101 includes two hardware threads 101 a and 101 b,which may also be referred to as hardware thread slots 101 a and 101 b.Therefore, software entities, such as an operating system, in oneembodiment potentially view processor 100 as four separate processors,i.e., four logical processors or processing elements capable ofexecuting four software threads concurrently. As alluded to above, afirst thread is associated with architecture state registers 101 a, asecond thread is associated with architecture state registers 101 b, athird thread may be associated with architecture state registers 102 a,and a fourth thread may be associated with architecture state registers102 b. Here, each of the architecture state registers (101 a, 101 b, 102a, and 102 b) may be referred to as processing elements, thread slots,or thread units, as described above. As illustrated, architecture stateregisters 101 a are replicated in architecture state registers 101 b, soindividual architecture states/contexts are capable of being stored forlogical processor 101 a and logical processor 101 b. In core 101, othersmaller resources, such as instruction pointers and renaming logic inallocator and renamer block 130 may also be replicated for threads 101 aand 101 b. Some resources, such as re-order buffers inreorder/retirement unit 135, ILTB 120, load/store buffers, and queuesmay be shared through partitioning. Other resources, such as generalpurpose internal registers, page-table base register(s), low-leveldata-cache and data-TLB 115, execution unit(s) 140, and portions ofout-of-order unit 135 are potentially fully shared.

Processor 100 often includes other resources, which may be fully shared,shared through partitioning, or dedicated by/to processing elements. InFIG. 1, an embodiment of a purely exemplary processor with illustrativelogical units/resources of a processor is illustrated. Note that aprocessor may include, or omit, any of these functional units, as wellas include any other known functional units, logic, or firmware notdepicted. As illustrated, core 101 includes a simplified, representativeout-of-order (OOO) processor core. But an in-order processor may beutilized in different embodiments. The OOO core includes a branch targetbuffer 120 to predict branches to be executed/taken and aninstruction-translation buffer (I-TLB) 120 to store address translationentries for instructions.

Core 101 further includes decode module 125 coupled to fetch unit 120 todecode fetched elements. Fetch logic, in one embodiment, includesindividual sequencers associated with thread slots 101 a, 101 b,respectively. Usually core 101 is associated with a first ISA, whichdefines/specifies instructions executable on processor 100. Oftenmachine code instructions that are part of the first ISA include aportion of the instruction (referred to as an opcode), whichreferences/specifies an instruction or operation to be performed. Decodelogic 125 includes circuitry that recognizes these instructions fromtheir opcodes and passes the decoded instructions on in the pipeline forprocessing as defined by the first ISA. For example, as discussed inmore detail below decoders 125, in one embodiment, include logicdesigned or adapted to recognize specific instructions, such astransactional instruction. As a result of the recognition by decoders125, the architecture or core 101 takes specific, predefined actions toperform tasks associated with the appropriate instruction. It isimportant to note that any of the tasks, blocks, operations, and methodsdescribed herein may be performed in response to a single or multipleinstructions; some of which may be new or old instructions. Notedecoders 126, in one embodiment, recognize the same ISA (or a subsetthereof). Alternatively, in a heterogeneous core environment, decoders126 recognize a second ISA (either a subset of the first ISA or adistinct ISA).

In one example, allocator and renamer block 130 includes an allocator toreserve resources, such as register files to store instructionprocessing results. However, threads 101 a and 101 b are potentiallycapable of out-of-order execution, where allocator and renamer block 130also reserves other resources, such as reorder buffers to trackinstruction results. Unit 130 may also include a register renamer torename program/instruction reference registers to other registersinternal to processor 100. Reorder/retirement unit 135 includescomponents, such as the reorder buffers mentioned above, load buffers,and store buffers, to support out-of-order execution and later in-orderretirement of instructions executed out-of-order.

Scheduler and execution unit(s) block 140, in one embodiment, includes ascheduler unit to schedule instructions/operation on execution units.For example, a floating point instruction is scheduled on a port of anexecution unit that has an available floating point execution unit.Register files associated with the execution units are also included tostore information instruction processing results. Exemplary executionunits include a floating point execution unit, an integer executionunit, a jump execution unit, a load execution unit, a store executionunit, and other known execution units.

Lower level data cache and data translation buffer (D-TLB) 150 arecoupled to execution unit(s) 140. The data cache is to store recentlyused/operated on elements, such as data operands, which are potentiallyheld in memory coherency states. The D-TLB is to store recentvirtual/linear to physical address translations. As a specific example,a processor may include a page table structure to break physical memoryinto a plurality of virtual pages.

Here, cores 101 and 102 share access to higher-level or further-outcache, such as a second level cache associated with on-chip interface110. Note that higher-level or further-out refers to cache levelsincreasing or getting further way from the execution unit(s). In oneembodiment, higher-level cache is a last-level data cache—last cache inthe memory hierarchy on processor 100—such as a second or third leveldata cache. However, higher level cache is not so limited, as it may beassociated with or include an instruction cache. A trace cache—a type ofinstruction cache—instead may be coupled after decoder 125 to storerecently decoded traces. Here, an instruction potentially refers to amacro-instruction (i.e. a general instruction recognized by thedecoders), which may decode into a number of micro-instructions(micro-operations).

In the depicted configuration, processor 100 also includes on-chipinterface module 110. Historically, a memory controller, which isdescribed in more detail below, has been included in a computing systemexternal to processor 100. In this scenario, on-chip interface 11 is tocommunicate with devices external to processor 100, such as systemmemory 175, a chipset (often including a memory controller hub toconnect to memory 175 and an I/O controller hub to connect peripheraldevices), a memory controller hub, a northbridge, or other integratedcircuit. And in this scenario, bus 105 may include any knowninterconnect, such as multi-drop bus, a point-to-point interconnect, aserial interconnect, a parallel bus, a coherent (e.g. cache coherent)bus, a layered protocol architecture, a differential bus, and a GTL bus.

Memory 175 may be dedicated to processor 100 or shared with otherdevices in a system. Common examples of types of memory 175 includeDRAM, SRAM, non-volatile memory (NV memory), and other known storagedevices. Note that device 180 may include a graphic accelerator,processor or card coupled to a memory controller hub, data storagecoupled to an I/O controller hub, a wireless transceiver, a flashdevice, an audio controller, a network controller, or other knowndevice.

Recently however, as more logic and devices are being integrated on asingle die, such as SOC, each of these devices may be incorporated onprocessor 100. For example in one embodiment, a memory controller hub ison the same package and/or die with processor 100. Here, a portion ofthe core (an on-core portion) 110 includes one or more controller(s) forinterfacing with other devices such as memory 175 or a graphics device180. The configuration including an interconnect and controllers forinterfacing with such devices is often referred to as an on-core (orun-core configuration). As an example, on-chip interface 110 includes aring interconnect for on-chip communication and a high-speed serialpoint-to-point link 105 for off-chip communication. Yet, in the SOCenvironment, even more devices, such as the network interface,co-processors, memory 175, graphics processor 180, and any other knowncomputer devices/interface may be integrated on a single die orintegrated circuit to provide small form factor with high functionalityand low power consumption.

In one embodiment, processor 100 is capable of executing a compiler,optimization, and/or translator code 177 to compile, translate, and/oroptimize application code 176 to support the apparatus and methodsdescribed herein or to interface therewith. A compiler often includes aprogram or set of programs to translate source text/code into targettext/code. Usually, compilation of program/application code with acompiler is done in multiple phases and passes to transform hi-levelprogramming language code into low-level machine or assembly languagecode. Yet, single pass compilers may still be utilized for simplecompilation. A compiler may utilize any known compilation techniques andperform any known compiler operations, such as lexical analysis,preprocessing, parsing, semantic analysis, code generation, codetransformation, and code optimization.

Larger compilers often include multiple phases, but most often thesephases are included within two general phases: (1) a front-end, i.e.generally where syntactic processing, semantic processing, and sometransformation/optimization may take place, and (2) a back-end, i.e.generally where analysis, transformations, optimizations, and codegeneration takes place. Some compilers refer to a middle, whichillustrates the blurring of delineation between a front-end and back endof a compiler. As a result, reference to insertion, association,generation, or other operation of a compiler may take place in any ofthe aforementioned phases or passes, as well as any other known phasesor passes of a compiler. As an illustrative example, a compilerpotentially inserts operations, calls, functions, etc. in one or morephases of compilation, such as insertion of calls/operations in afront-end phase of compilation and then transformation of thecalls/operations into lower-level code during a transformation phase.Note that during dynamic compilation, compiler code or dynamicoptimization code may insert such operations/calls, as well as optimizethe code for execution during runtime. As a specific illustrativeexample, binary code (already compiled code) may be dynamicallyoptimized during runtime. Here, the program code may include the dynamicoptimization code, the binary code, or a combination thereof.

Similar to a compiler, a translator, such as a binary translator,translates code either statically or dynamically to optimize and/ortranslate code. Therefore, reference to execution of code, applicationcode, program code, or other software environment may refer to: (1)execution of a compiler program(s), optimization code optimizer, ortranslator either dynamically or statically, to compile program code, tomaintain software structures, to perform other operations, to optimizecode, or to translate code; (2) execution of main program code includingoperations/calls, such as application code that has beenoptimized/compiled; (3) execution of other program code, such aslibraries, associated with the main program code to maintain softwarestructures, to perform other software related operations, or to optimizecode; or (4) a combination thereof.

As process technology development becomes more and more complex,Multi-Chip Package (MCP) technology, whereby a collection of multiplesmaller dies are connected to each other, becomes increasinglyprevalent. Multiple protocol layers in these smaller dies can be timemultiplexed and connected with each other using a single on-packageinterconnect (e.g. Rosetta-Link (or R-Link) technology). In general, aprotocol link layer can have control of its own link states. However,these multiple protocol layers which tunnel through the same on-packageinterconnect can be agnostic to each other, which creates a contentionbetween these multiple protocol layers on who is in control of the linkstate. This disclosure described systems, methods, and apparatuses toresolve contentions between multiple protocol layers.

This disclosure describes a method to virtualize the link states of eachprotocol layer that share the same on-package interconnect. Thevirtualization of link states allows the protocol layers (both softwareand hardware) to appear as if they have ownership of the link states.

With the wider adoption of die-to-die interconnect technology, theability to not only tunnel multiple protocols over the interconnect, butalso having a method to virtualize each protocols link states can bebeneficial from power efficiency and ease of adoption perspective.

FIG. 2 is a schematic diagram of an example R-Link interconnecting twodies in accordance with embodiments of the present disclosure. Turningto FIG. 2, a simplified block diagram 200 is shown representing at leasta portion of a system including an example implementation of a multichippackage link (MCPL). An MCPL can be implemented using physicalelectrical connections (e.g., wires implemented as lanes) connecting afirst device 202 (e.g., a first die including one or moresub-components) with a second device 222 (e.g., a second die includingone or more other sub-components). In the particular example shown inthe high-level representation of diagram 200, all signals (in channels240, 242) can be unidirectional and lanes can be provided for the datasignals to have both an upstream and downstream data transfer.

In one example implementation, an MCPL can provide a physical layer(PHY) including the electrical MCPL PHY 208, 228 and executable logicimplementing MCPL logical PHY 212, 232. Electrical, or physical, PHY208, 228 can provide the physical connection over which data iscommunicated between devices 202, 222. Signal conditioning componentsand logic can be implemented in connection with the physical PHY 208,228 in order to establish high data rate and channel configurationcapabilities of the link, which in some applications can involve tightlyclustered physical connections at lengths of approximately 45 mm ormore. The logical PHY 212, 232 can include logic for facilitatingclocking, link state management (e.g., for link layers 204, 206, 224,226), and protocol multiplexing between potentially multiple, differentprotocols used for communications over the MCPL.

In one example implementation, physical PHY 208, 228 can include, foreach channel (e.g., 240, 242) a set of data lanes, over which in-banddata can be sent. In this particular example, 50 data lanes are providedin each of the upstream and downstream channels 240, 242, although anyother number of lanes can be used as permitted by the layout and powerconstraints, desired applications, device constraints, etc. Each channelcan further include one or more dedicated lanes for a strobe, or clock,signal for the channel, one or more dedicated lanes for a valid signalfor the channel, one or more dedicated lanes for a stream signal, andone or more dedicated lanes for a link state machine management orsideband signal. The physical PHY can further include a sideband link244, which, in some examples, can be a bi-directional lower frequencycontrol signal link used to coordinate state transitions and otherattributes of the MCPL connecting devices 202, 222 among other examples.

As noted above, multiple protocols can be supported using animplementation of MCPL. Indeed, multiple, independent transaction layersand link layers 204, 206, 224, 226 can be provided at each device 202,222. For instance, each device 202, 222 may support and utilize two ormore protocols, such as PCI, PCIe, QPI, Intel In-Die Interconnect (IDI),among others. IDI is a coherent protocol used on-die to communicatebetween cores, Last Level Caches (LLCs), memory, graphics, and IOcontrollers. Other protocols can also be supported including Ethernetprotocol, Infiniband protocols, and other PCIe fabric based protocols.The combination of the Logical PHY and physical PHY can also be used asa die-to-die interconnect to connect a SerDes PHY (PCIe, Ethernet,Infiniband or other high speed SerDes) on one die to its upper layersthat are implemented on the other die, among other examples.

Logical PHY 212, 232 can support multiplexing between these multipleprotocols on an MCPL. For instance, the dedicated stream lane can beused to assert an encoded stream signal that identifies which protocolis to apply to data sent substantially concurrently on the data lanes ofthe channel. Further, logical PHY 212, 232 can be used to negotiate thevarious types of link state transitions that the various protocols maysupport or request. In some instances, LSM_SB signals sent over thechannel's dedicated LSM_SB lane can be used, together with side bandlink 244 to communicate and negotiate link state transitions between thedevices 202, 222. Further, link training, error detection, skewdetection, de-skewing, and other functionality of traditionalinterconnects can be replaced or governed, in part using logical PHY212, 232. For instance, valid signals sent over one or more dedicatedvalid signal lanes in each channel can be used to signal link activity,detect skew, link errors, and realize other features, among otherexamples. In the particular example of FIG. 2, multiple valid lanes areprovided per channel. For instance, data lanes within a channel can bebundled or clustered (physically and/or logically) and a valid lane canbe provided for each cluster. Further, multiple strobe lanes can beprovided, in some cases, also to provide a dedicated strobe signal foreach cluster in a plurality of data lane clusters in a channel, amongother examples.

As noted above, logical PHY 212, 232 can be used to negotiate and managelink control signals sent between devices connected by the MCPL. In someimplementations, logical PHY 212, 232 can include link layer packet(LLP) generation logic 214, 234 that can be used to send link layercontrol messages over the MCPL (i.e., in band). Such messages can besent over data lanes of the channel, with the stream lane identifyingthat the data is link layer-to-link layer messaging, such as link layercontrol data, among other examples. Link layer messages enabled usingLLP module 214, 234 can assist in the negotiation and performance oflink layer state transitioning, power management, loopback, disable,re-centering, scrambling, among other link layer features between thelink layers 204, 206, 224, 226 of devices 202, 222 respectively.

Each device 202, 222 can include an arbitration and multiplexing logic(ARB/MUX) 210, 230, respectively. The ARB/MUX 210, 230 can be used toarbitrate between different protocols supported by the dies. The ARB/MUX210, 230 is the logic that performs arbitration and multiplexing ofmultiple protocols over the R-Link interconnect.

Turning to FIG. 3, a simplified block diagram 300 is shown illustratingan example logical PHY of an example MCPL. A physical PHY 302 canconnect to a die that includes logical PHY 304 and additional logicsupporting a link layer of the MCPL. The die, in this example, canfurther include logic to support multiple different protocols on theMCPL. For instance, in the example of FIG. 3, PCIe logic 306 can beprovided as well as in-die interconnect (IDI) logic 308, such that thedies can communicate using either PCIe or IDI over the same MCPLconnecting the two dies, among potentially many other examples,including examples where more than two protocols or protocols other thanPCIe and IDI are supported over the MCPL. Various protocols supportedbetween the dies can offer varying levels of service and features.

Logical PHY 304 can include link state machine (LSM) management logic310 for negotiating link state transitions in connection with requestsof upper layer logic of the die (e.g., received over PCIe or IDI).Logical PHY 304 can further include link testing and debug logic (e.g.,312) ion some implementations. As noted above, an example MCPL cansupport control signals that are sent between dies over the MCPL tofacilitate protocol agnostic, high performance, and power efficiencyfeatures (among other example features) of the MCPL. For instance,logical PHY 310 can support the generation and sending, as well as thereceiving and processing of valid signals, stream signals, and LSMsideband signals in connection with the sending and receiving of dataover dedicated data lanes, such as described in examples above.

In some implementations, multiplexing (e.g., 314) and demultiplexing(e.g., 316) logic can be included in, or be otherwise accessible to,logical PHY 310. For instance, multiplexing logic (e.g., 314) can beused to identify data (e.g., embodied as packets, messages, etc.) thatis to be sent out onto the MCPL. The multiplexing logic 314 can identifythe protocol governing the data and generate a stream signal that isencoded to identify the protocol. For instance, in one exampleimplementation, the stream signal can be encoded as a byte of twohexadecimal symbols (e.g., IDI: FFh; PCIe: F0h; LLP: AAh; sideband: 55h;etc.), and can be sent during the same window (e.g., a byte time periodwindow) of the data governed by the identified protocol. Similarly,demultiplexing logic 316 can be employed to interpret incoming streamsignals to decode the stream signal and identify the protocol that is toapply to data concurrently received with the stream signal on the datalanes. The demultiplexing logic 316 can then apply (or ensure)protocol-specific link layer handling and cause the data to be handledby the corresponding protocol logic (e.g., PCIe logic 306 or IDI logic308).

Logical PHY 310 can further include link layer packet logic 318 that canbe used to handle various link control functions, including powermanagement tasks, loopback, disable, re-centering, scrambling, etc. LLPlogic 318 can facilitate link layer-to-link layer messages over MCLP,among other functions. Data corresponding to the LLP signaling can bealso be identified by a stream signal sent on a dedicated stream signallane that is encoded to identify that the data lanes LLP data.Multiplexing and demultiplexing logic (e.g., 314, 316) can also be usedto generate and interpret the stream signals corresponding to LLPtraffic, as well as cause such traffic to be handled by the appropriatedie logic (e.g., LLP logic 318). Likewise, as some implementations of anMCLP can include a dedicated sideband (e.g., sideband 320 and supportinglogic), such as an asynchronous and/or lower frequency sideband channel,among other examples.

Logical PHY logic 304 can further include link state machine managementlogic that can generate and receive (and use) link state managementmessaging over a dedicated LSM sideband lane. For instance, an LSMsideband lane can be used to perform handshaking to advance linktraining state, exit out of power management states (e.g., an L1 state),among other potential examples. The LSM sideband signal can be anasynchronous signal, in that it is not aligned with the data, valid, andstream signals of the link, but instead corresponds to signaling statetransitions and align the link state machine between the two die orchips connected by the link, among other examples. Providing a dedicatedLSM sideband lane can, in some examples, allow for traditional squelchand received detect circuits of an analog front end (AFE) to beeliminated, among other example benefits.

Turning to FIG. 4, a simplified block diagram 400 is shown illustratinganother representation of logic used to implement an MCPL. For instance,logical PHY 304 is provided with a defined logical PHY interface (LPIF)404 through which any one of a plurality of different protocols 406,408, 410, 412 (e.g., PCIe, IDI, QPI, etc.) and signaling modes (e.g.,sideband) can interface with the physical layer of an example MCPL. Insome implementations, multiplexing and arbitration logic 402 can also beprovided as a layer separate from the logical PHY 310. In one example,the LPIF 404 can be provided as the interface on either side of thisARB/MUX logic 402. The logical PHY 310 can interface with the physicalPHY (e.g., an analog front end (AFE)) 302 of the MCPL PHY) throughanother interface.

The LPIF can abstract the PHY (logical and electrical/analog) from theupper layers (e.g., 406, 408, 410, 412) such that a completely differentPHY can be implemented under LPIF transparent to the upper layers. Thiscan assist in promoting modularity and re-use in design, as the upperlayers can stay intact when the underlying signaling technology PHY isupdated, among other examples. Further, the LPIF can define a number ofsignals enabling multiplexing/demultiplexing, LSM management, errordetection and handling, and other functionality of the logical PHY. Forinstance, Table 1 summarizes at least a portion of signals that can bedefined for an example LPIF:

TABLE 1 Nonexhaustive List of Signals Defined for an Example LPIF SignalName Description Rst Reset Lclk Link Clock - 8UI of PHY clock Pl_trdyPhysical Layer is ready to accept data, data is accepted by Physicallayer when Pl_trdy and Lp_valid are both asserted. Pl_data[N-1:0][7:0]Physical Layer-to-Link Layer data, where N equals the number of lanes.Pl_valid Physical Layer-to-Link Layer signal indicating data validPl_Stream[7:0] Physical Layer-to-Link Layer signal indicating the streamID received with received data Pl_error Physical layer detected an error(e.g., framing or training) Pl_AlignReq Physical Layer request to LinkLayer to align packets at LPIF width boundary Pl_in_L0 Indicates thatlink state machine (LSM) is in L0 Pl_in_retrain Indicates that LSM is inRetrain/Recovery Pl_rejectL1 Indicates that the PHY layer has rejectedentry into L1. Pl_in_L12 Indicates that LSM is in L1 or L2. Pl_LSM (3:0)Current LSM state information Lp_data[N-1:0][7:0] Link Layer-to-PhysicalLayer Data, where N equals number of lanes. Lp_Stream[7:0] LinkLayer-to-Physical Layer signal indicating the stream ID to use with dataLp_AlignAck Link Layer to Physical layer indicates that the packets arealigned LPIF width boundary Lp_valid Link Layer-to-Physical Layer signalindicating data valid Lp_enterL1 Link Layer Request to Physical Layer toenter L1 Lp_enterL2 Link Layer Request to Physical Layer to enter L2Lp_Retrain Link Layer Request to Physical Layer to Retrain the PHYLp_exitL12 Link Layer Request to Physical Layer to exit L1, L2Lp_Disable Link Layer Request to Physical Layer to disable PHY

As noted in Table 1, in some implementations, an alignment mechanism canbe provided through an AlignReq/AlignAck handshake. For example, whenthe physical layer enters recovery, some protocols may lose packetframing. Alignment of the packets can be corrected, for instance, toguarantee correct framing identification by the link layer.

Various fault tolerances can be defined for signals on the MCPL. Forinstance, fault tolerances can be defined for valid, stream, LSMsideband, low frequency side band, link layer packets, and other typesof signals. Fault tolerances for packets, messages, and other data sentover the dedicated data lanes of the MCPL can be based on the particularprotocol governing the data. In some implementations, error detectionand handling mechanisms can be provided, such as cyclic redundancy check(CRC), retry buffers, among other potential examples. As examples, forPCIe packets sent over the MCPL, 32-bit CRC can be utilized for PCIetransaction layer packets (TLPs) (with guaranteed delivery (e.g.,through a replay mechanism)) and 16-bit CRC can be utilized for PCIelink layer packets (which may be architected to be lossy (e.g., wherereplay is not applied)). Further, for PCIe framing tokens, a particularhamming distance (e.g., hamming distance of four (4)) can be defined forthe token identifier; parity and 4-bit CRC can also be utilized, amongother examples. For IDI packets, on the other hand, 16-bit CRC can beutilized.

In some implementations, fault tolerances can be defined for link layerpackets (LLPs) that include requiring a valid signal to transition fromlow to high (i.e., 0-to-1) (e.g., to assist in assuring bit and symbollock). Further, in one example, a particular number of consecutive,identical LLPs can be defined to be sent and responses can be expectedto each request, with the requestor retrying after a response timeout,among other defined characteristics that can be used as the basis ofdetermining faults in LLP data on the MCPL. In further examples, faulttolerance can be provided for a valid signal, for instance, throughextending the valid signal across an entire time period window, orsymbol (e.g., by keeping the valid signal high for eight UIs).Additionally, errors or faults in stream signals can be prevented bymaintaining a hamming distance for encodings values of the streamsignal, among other examples.

Implementations of a logical PHY can include error detection, errorreporting, and error handling logic. In some implementations, a logicalPHY of an example MCPL can include logic to detect PHY layer de-framingerrors (e.g., on the valid and stream lanes), sideband errors (e.g.,relating to LSM state transitions), errors in LLPs (e.g., that arecritical to LSM state transitions), among other examples. Some errordetection/resolution can be delegated to upper layer logic, such as PCIelogic adapted to detect PCIe-specific errors, among other examples.

In the case of de-framing errors, in some implementations, one or moremechanisms can be provided through error handling logic. De-framingerrors can be handled based on the protocol involved. For instance, insome implementations, link layers can be informed of the error totrigger a retry. De-framing can also cause a realignment of the logicalPHY de-framing. Further, re-centering of the logical PHY can beperformed and symbol/window lock can be reacquired, among othertechniques. Centering, in some examples, can include the PHY moving thereceiver clock phase to the optimal point to detect the incoming data.“Optimal,” in this context, can refer to where it has the most marginfor noise and clock jitter. Re-centering can include simplifiedcentering functions, for instance, performed when the PHY wakes up froma low power state, among other examples.

Other types of errors can involve other error handling techniques. Forinstance, errors detected in a sideband can be caught through a time-outmechanism of a corresponding state (e.g., of an LSM). The error can belogged and the link state machine can then be transitioned to Reset. TheLSM can remain in Reset until a restart command is received fromsoftware. In another example, LLP errors, such as a link control packeterror, can be handled with a time-out mechanism that can re-start theLLP sequence if an acknowledgement to the LLP sequence is not received.

FIG. 5 is a schematic diagram illustrating a Multichip Package Link(MCPL) 500 illustrating example locations of Physical Link StateMachines and Virtual Link State Machines in accordance with embodimentsof the present disclosure. The MCPL 500 is similar or can have similarfunctionality to the structures shown in FIGS. 2-4. Device (or die) 1202 can include two more interconnect protocol component elements, suchas IDI transaction & link layer hardware and software 204 and PCIetransaction & link layer hardware and software 206. The device 1 202 caninclude physical PHY 208 represented by the R-link PHY 208, a logicalPHY represented by R-Link Logical PHY 212, and ARB/MUX 210.

Device (or die) 2 222 can include two more interconnect protocolcomponent elements, such as IDI transaction & link layer hardware andsoftware 224 and PCIe transaction & link layer hardware and software226. The device 1 222 can include physical PHY 228 represented by theR-link PHY 228, a logical PHY represented by R-Link Logical PHY 232, andARB/MUX 230.

FIG. 5 shows locations of the Physical Link State Machine (P-LSM) 508,528 and Virtual Link State Machine (V-LSM) within the R-Link stack. Eachdie can have its own sets of P-LSM and V-LSM which are a mirroredversion of the opposite die. The P-LSM governs the actual physical linkstate and it is located in the R-Link Logical PHY. Each protocol layercan have its own link state virtualized by a V-LSM. In FIG. 5, V-LSM #0502, 522 virtualizes the link states of the ARB-MUX protocol layer 210,230, respectively; V-LSM #1 504, 524 virtualizes the link states of theIDI protocol layer 204, 224, respectively; and V-LSM #2 506, 526virtualizes the link states of the PCIe protocol layer 206, 226. Listedbelow are examples of link states that can be virtualized:—

1) Reset

2) Active (L0)

3) Idle (L1)

4) Sleep (L2)

5) Retrain/Recovery

6) Disable

7) Link Reset

8) Link Error

By virtualizing the link states, this disclosure facilitates protocollayers to be agnostic to each other. Thus enabling the protocol layers'hardware or software drivers to control their own link states as if theyown the link exclusively. This reduces hardware/software adoptioncomplexity since they are shielded by the V-LSM from the need tounderstand the concept of shared/multiplexed link. Furthermore, byhaving the V-LSM, protocol layers are allowed to enter idle state (thusenabling power management features) independent of each other. Table 2illustrates that this disclosure solution allows Protocol Layer #2 toenter “Idle” state as early as Seq #3. On the other hand, Table 3illustrates how link state transitions without virtualization would haveonly allowed Protocol Layer #2 to enter “Idle” state at Seq #7 (i.e.after all protocol layers are ready to enter “Idle” state). This showsthat this disclosure provides a clear benefit from power efficiencyperspective.

TABLE 2 Example of how each protocol layer link states would be based onthis disclosure solution Link State Machine Status Seq# Events V-LSM #2V-LSM #1 V-LSM #0 P-LSM 1 . . . Active Active Active Active 2 ProtocolLayer #2 Active Active Active Active Idle State Request 3 . . . IdleActive Active Active 4 Protocol Layer #1 Idle Active Active Active IdleState Request 5 . . . Idle Idle Active Active 6 ARB-MUX Layer Idle IdleActive Active Idle State Request 7 . . . Idle Idle Idle Idle

TABLE 3 Example of how each protocol layer link states would be withoutvirtualization Link State Machine Status Seq# Events LSM #2* LSM #1* LSM#0* P-LSM 1 . . . Active Active Active Active 2 Protocol Layer ActiveActive Active Active #2 Idle State Request 3 . . . Active Active ActiveActive 4 Protocol Layer Active Active Active Active #1 Idle StateRequest 5 . . . Active Active Active Active 6 ARB-MUX Active ActiveActive Active Layer Idle State Request 7 . . . Idle Idle Idle Idle

Link State Machines are not virtualized and hence each column reflectthe actual P-LSM state. Without virtualization, physical link states aremaintained for each LSM despite requests for link state changes.

FIG. 6 is a schematic diagram of an example physical layer packet (PLP)600 format in accordance with embodiments of the present disclosure.Virtualization of the Link State Machines is achieved by having eachdie's V-LSM communicate with each other over the on-package interconnectusing “Physical Layer Packet” (PLP). The R-Link PLP is defined as a oneDouble-Word (1DW) data packet that originates from one Physical Layer(e.g. Logical PHY or ARB-MUX) and terminates at the opposite PhysicalLayer. FIG. 6 illustrates a generic 1 DW structure/format for a PLP. ThePLPs used for virtualization of the R-Link V-LSMs are calledLPIF_STATE_CONTROL PLP. The specific definition of Byte1, Byte2 andByte3 are shown in Tables 4 and 5 below.

TABLE 4 Byte 1 Definition of R-Link Physical Layer Packet MessageEncoding [Byte 1] Description 0000_0001 LINK_CONTROL: Used to configurethe link and for ACTIVE to Next state transition. Request type PLP issent only from upstream devices to downstream devices. AcknowledgementPLP type is sent only from downstream devices to upstream devices.0000_0010 FLUSH: Used to do an in-band flush of all packets beforespecific state changes. This PLP is sent from both upstream anddownstream devices. 0000_0011 Reserved 0000_0100 PM_ENTER_IDLE_L1: Usedby downstream devices to request entry into IDLE_L1. This PLP is sentonly from downstream devices to upstream devices. 0000_0101PM_ENTER_SLEEP_L2: Used by downstream devices to request entry intoIDLE_L2. This PLP is sent only from downstream devices to upstreamdevices. 0000_1111 PM_REQUEST_NAK: Used by upstream devices to NAK L1entry request from downstream devices. This PLP is sent only fromupstream devices to downstream devices. 0000_1000 LPIF_STATE_CONTROL:Used to control LPIF state transition. This PLP is sent from bothupstream and downstream devices. All Others Reserved

TABLE 5 Byte 2 and Byte 3 Definition of the R- Link LPIF_STATE_CONTROLPLP Byte 2 Bit Description 3:0 LPIF State Encoding: 0000: RESET (ForStatus Only) 0001: ACTIVE 0010: Reserved 0011: Deepest Allowable PMState (For Request Only) 0100: L1.1 0101: L1.2 0110: L1.3 0111: L1.41000: L2 1001: LINKRESET 1010: LINKERROR (For Status Only) 1011: RETRAIN(For Status Only) 1100: DISABLE 1101: Reserved 1110: Reserved 1111:Reserved 6:4 Reserved 7 Request/Status Type 1: LPIF_STATE_CONTROLRequest PLP 0: LPIF_STATE_CONTROL Status PLP Byte 3 Bit Description 3:0LPIF Instance Number: Indicates the targeted LPIF interface when there'smultiple LPIF interfaces present. Note: Use a value ‘0000b’ in the caseof single LPIF interface. 7:4 Reserved

The LPIF_STATE_CONTROL PLP is used as a full handshake between thematching V-LSMs on both die to convey request and status for thevirtualized link states. A V-LSM can send a LPIF_STATE_CONTROL Request(a.k.a. STATE_REQ) PLP to convey its intention to enter a specificvirtualized link state. The receiver of the PLP can respond with aLPIF_STATE_CONTROL Status (a.k.a. STATE_STS) PLP once it is ready toenter into the requested virtualized state.

FIG. 7 is a swim lane diagram illustrating example message flows forchanging virtual and physical link states from an active state to anidle state in accordance with embodiments of the present disclosure.FIG. 7 illustrates an example flow on how the V-LSMs enter into IDLE_L1state, though other state changes can be performed in a similar (thoughnot necessarily identical) manner. FIGS. 8A-8C are schematic diagramsillustrating Multichip Package Link (MCPL) illustrating message flowpathways in accordance with embodiments of the present disclosure. FIG.7 and FIGS. 8A-8C can be taken together to better depict the messageflow between the two dies.

Virtual link states can be maintained by the ARB/MUX of each die foreach protocol supported by each die. The ARB/MUX of each die can providevarious functions, including maintaining virtual link states andchanging virtual link states based on requests.

I) At the outset, Die 2 V-LSM #2 Requests for IDLE_L1 state entry:

1a) Die 2 Protocol #2 requests for IDLE_L1 state entry and 1b) theARB/MUX of die 2 sends a STATE_REQ PLP IDLE_L1 across the link to Die 1.1c) Die 1 V-LSM #2 receives the PLP and prepares Protocol #2 for IDLE_L1entry.

II) Die 1 V-LSM #2 Acknowledging IDLE_L1 state entry:

2a) Die 1 Protocol #2 informs V-LSM #2 it is ready for IDLE_L1 entry(e.g., after completing any pending transactions). 2b) Die 1 V-LSM #2sends STATE_STS PLP IDLE_L1 to Die 2 across link. 2c) Die 2 V-LSM #2informs Protocol #2 IDLE_L1 state entry is completed.

III) At the outset, Die 2 V-LSM #1 Requests for IDLE_L1 state entry:

3a) Die 2 Protocol #1 requests for IDLE_L1 state entry and 3b) sends aSTATE_REQ PLP IDLE_L1 across the link to Die 1. 3c) Die 1 V-LSM #1receives the PLP and prepares Protocol #1 for IDLE_L1 entry.

IV) Die 1 V-LSM #1 Acknowledging IDLE_L1 state entry:

4a) Die 1 Protocol #1 informs V-LSM #1 it is ready for IDLE_L1 entry(e.g., after completing any pending transactions). 4b) Die 1 V-LSM #1sends STATE_STS PLP IDLE_L1 to Die 2 across link. 4c) Die 2 V-LSM #1informs Protocol #1 IDLE_L1 state entry is completed.

V) Die 2 V-LSM #0 Requesting for IDLE_L1 state entry:

5a) Die 2ARB-MUX requests for IDLE_L1 state entry and 5b) sends aSTATE_REQ PLP IDLE_L1 to Die 1 across link. 5c) Die 1 V-LSM #0 receivesthe PLP and prepares ARB-MUX for IDLE_L1 entry.

VI) Die 1 V-LSM #0 Acknowledging IDLE_L1 state entry:

6a) Die 1 ARB-MUX informs V-LSM #0 it is ready for IDLE_L1 entry. 6b)Die 1 V-LSM #0 sends STATE_STS PLP IDLE_L1 to Die 2 across link. 6c) Die2 V-LSM #0 informs ARB-MUX IDLE_L1 state entry is completed.

Besides being used for virtualization, these PLP handshakes also allowsprotocol layers (e.g. coherent protocol) to enter virtualized link statewithout the need of higher level handshakes at the protocol layer side.For example, a coherent protocol layer could request for IDLE_L1 linkstate entry purely based on its local protocol's idleness. The V-LSMs onboth dies can serve as an apparatus to the protocol stacks on both diesto enter their IDLE_L1 link state. Noteworthy is that at the outset, theP-LSM indicates an L0 state, and by the end of the messaging, the P-LSMis in L1.

The figures above describe a simplified flow whereby one die is themaster of the V-LSM request while the other die is always the slave. Thesystems, methods, devices, and computer program products describedherein can be mirrored; or can be applied for implementations where eachdie can have dual roles (i.e. both master and slave).

Referring to FIG. 9, an embodiment of a fabric composed ofpoint-to-point Links that interconnect a set of components isillustrated. System 900 includes processor 905 and system memory 910coupled to controller hub 915. Processor 905 includes any processingelement, such as a microprocessor, a host processor, an embeddedprocessor, a co-processor, or other processor. Processor 905 is coupledto controller hub 915 through front-side bus (FSB) 906. In oneembodiment, FSB 906 is a serial point-to-point interconnect as describedbelow. In another embodiment, link 906 includes a serial, differentialinterconnect architecture that is compliant with different interconnectstandard.

System memory 910 includes any memory device, such as random accessmemory (RAM), non-volatile (NV) memory, or other memory accessible bydevices in system 900. System memory 910 is coupled to controller hub915 through memory interface 916. Examples of a memory interface includea double-data rate (DDR) memory interface, a dual-channel DDR memoryinterface, and a dynamic RAM (DRAM) memory interface.

In one embodiment, controller hub 915 is a root hub, root complex, orroot controller in a Peripheral Component Interconnect Express (PCIe orPCIE) interconnection hierarchy. Examples of controller hub 915 includea chipset, a memory controller hub (MCH), a northbridge, an interconnectcontroller hub (ICH) a southbridge, and a root controller/hub. Often theterm chipset refers to two physically separate controller hubs, i.e. amemory controller hub (MCH) coupled to an interconnect controller hub(ICH). Note that current systems often include the MCH integrated withprocessor 905, while controller 915 is to communicate with I/O devices,in a similar manner as described below. In some embodiments,peer-to-peer routing is optionally supported through root complex 915.

Here, controller hub 915 is coupled to switch/bridge 920 through seriallink 919. Input/output modules 917 and 921, which may also be referredto as interfaces/ports 917 and 921, include/implement a layered protocolstack to provide communication between controller hub 915 and switch920. In one embodiment, multiple devices are capable of being coupled toswitch 920.

Switch/bridge 920 routes packets/messages from device 925 upstream, i.e.up a hierarchy towards a root complex, to controller hub 915 anddownstream, i.e. down a hierarchy away from a root controller, fromprocessor 905 or system memory 910 to device 925. Switch 920, in oneembodiment, is referred to as a logical assembly of multiple virtualPCI-to-PCI bridge devices. Device 925 includes any internal or externaldevice or component to be coupled to an electronic system, such as anI/O device, a Network Interface Controller (NIC), an add-in card, anaudio processor, a network processor, a hard-drive, a storage device, aCD/DVD ROM, a monitor, a printer, a mouse, a keyboard, a router, aportable storage device, a Firewire device, a Universal Serial Bus (USB)device, a scanner, and other input/output devices. Often in the PCIevernacular, such as device, is referred to as an endpoint. Although notspecifically shown, device 925 may include a PCIe to PCI/PCI-X bridge tosupport legacy or other version PCI devices. Endpoint devices in PCIeare often classified as legacy, PCIe, or root complex integratedendpoints.

Graphics accelerator 930 is also coupled to controller hub 915 throughserial link 932. In one embodiment, graphics accelerator 930 is coupledto an MCH, which is coupled to an ICH. Switch 920, and accordingly I/Odevice 925, is then coupled to the ICH. I/O modules 931 and 918 are alsoto implement a layered protocol stack to communicate between graphicsaccelerator 930 and controller hub 915. Similar to the MCH discussionabove, a graphics controller or the graphics accelerator 930 itself maybe integrated in processor 905.

Turning to FIG. 10 an embodiment of a layered protocol stack isillustrated. Layered protocol stack 1000 includes any form of a layeredcommunication stack, such as a Quick Path Interconnect (QPI) stack, aPCie stack, a next generation high performance computing interconnectstack, or other layered stack. Although the discussion immediately belowin reference to FIGS. 9-12 are in relation to a PCIe stack, the sameconcepts may be applied to other interconnect stacks. In one embodiment,protocol stack 1000 is a PCIe protocol stack including transaction layer1005, link layer 1010, and physical layer 1020. An interface, such asinterfaces 917, 918, 921, 922, 926, and 931 in FIG. 1, may berepresented as communication protocol stack 1000. Representation as acommunication protocol stack may also be referred to as a module orinterface implementing/including a protocol stack.

PCI Express uses packets to communicate information between components.Packets are formed in the Transaction Layer 1005 and Data Link Layer1010 to carry the information from the transmitting component to thereceiving component. As the transmitted packets flow through the otherlayers, they are extended with additional information necessary tohandle packets at those layers. At the receiving side the reverseprocess occurs and packets get transformed from their Physical Layer1020 representation to the Data Link Layer 1010 representation andfinally (for Transaction Layer Packets) to the form that can beprocessed by the Transaction Layer 1005 of the receiving device.

Transaction Layer

In one embodiment, transaction layer 1005 is to provide an interfacebetween a device's processing core and the interconnect architecture,such as data link layer 1010 and physical layer 1020. In this regard, aprimary responsibility of the transaction layer 1005 is the assembly anddisassembly of packets (i.e., transaction layer packets, or TLPs). Thetranslation layer 1005 typically manages credit-base flow control forTLPs. PCIe implements split transactions, i.e. transactions with requestand response separated by time, allowing a link to carry other trafficwhile the target device gathers data for the response.

In addition PCIe utilizes credit-based flow control. In this scheme, adevice advertises an initial amount of credit for each of the receivebuffers in Transaction Layer 1005. An external device at the oppositeend of the link, such as controller hub 115 in FIG. 1, counts the numberof credits consumed by each TLP. A transaction may be transmitted if thetransaction does not exceed a credit limit. Upon receiving a response anamount of credit is restored. An advantage of a credit scheme is thatthe latency of credit return does not affect performance, provided thatthe credit limit is not encountered.

In one embodiment, four transaction address spaces include aconfiguration address space, a memory address space, an input/outputaddress space, and a message address space. Memory space transactionsinclude one or more of read requests and write requests to transfer datato/from a memory-mapped location. In one embodiment, memory spacetransactions are capable of using two different address formats, e.g., ashort address format, such as a 32-bit address, or a long addressformat, such as 64-bit address. Configuration space transactions areused to access configuration space of the PCIe devices. Transactions tothe configuration space include read requests and write requests.Message space transactions (or, simply messages) are defined to supportin-band communication between PCIe agents.

Therefore, in one embodiment, transaction layer 1005 assembles packetheader/payload 1006. Format for current packet headers/payloads may befound in the PCIe specification at the PCIe specification website.

Quickly referring to FIG. 11, an embodiment of a PCIe transactiondescriptor is illustrated. In one embodiment, transaction descriptor1100 is a mechanism for carrying transaction information. In thisregard, transaction descriptor 1100 supports identification oftransactions in a system. Other potential uses include trackingmodifications of default transaction ordering and association oftransaction with channels.

Transaction descriptor 1100 includes global identifier field 1102,attributes field 1104 and channel identifier field 1106. In theillustrated example, global identifier field 1102 is depicted comprisinglocal transaction identifier field 1108 and source identifier field1110. In one embodiment, global transaction identifier 1102 is uniquefor all outstanding requests.

According to one implementation, local transaction identifier field 1108is a field generated by a requesting agent, and it is unique for alloutstanding requests that require a completion for that requestingagent. Furthermore, in this example, source identifier 1110 uniquelyidentifies the requestor agent within a PCIe hierarchy. Accordingly,together with source ID 1110, local transaction identifier 1108 fieldprovides global identification of a transaction within a hierarchydomain.

Attributes field 1104 specifies characteristics and relationships of thetransaction. In this regard, attributes field 1104 is potentially usedto provide additional information that allows modification of thedefault handling of transactions. In one embodiment, attributes field1104 includes priority field 1112, reserved field 1114, ordering field1116, and no-snoop field 1118. Here, priority sub-field 1112 may bemodified by an initiator to assign a priority to the transaction.Reserved attribute field 1114 is left reserved for future, orvendor-defined usage. Possible usage models using priority or securityattributes may be implemented using the reserved attribute field.

In this example, ordering attribute field 1116 is used to supplyoptional information conveying the type of ordering that may modifydefault ordering rules. According to one example implementation, anordering attribute of “0” denotes default ordering rules are to apply,wherein an ordering attribute of “1” denotes relaxed ordering, whereinwrites can pass writes in the same direction, and read completions canpass writes in the same direction. Snoop attribute field 1118 isutilized to determine if transactions are snooped. As shown, channel IDField 1106 identifies a channel that a transaction is associated with.

Link Layer

Link layer 1010, also referred to as data link layer 1010, acts as anintermediate stage between transaction layer 1005 and the physical layer1020. In one embodiment, a responsibility of the data link layer 1010 isproviding a reliable mechanism for exchanging Transaction Layer Packets(TLPs) between two components a link. One side of the Data Link Layer1010 accepts TLPs assembled by the Transaction Layer 1005, appliespacket sequence identifier 1011, i.e. an identification number or packetnumber, calculates and applies an error detection code, i.e. CRC 1012,and submits the modified TLPs to the Physical Layer 1020 fortransmission across a physical to an external device.

Physical Layer

In one embodiment, physical layer 1020 includes logical sub block 1021and electrical sub-block 1022 to physically transmit a packet to anexternal device. Here, logical sub-block 1021 is responsible for the“digital” functions of Physical Layer 1021. In this regard, the logicalsub-block includes a transmit section to prepare outgoing informationfor transmission by physical sub-block 1022, and a receiver section toidentify and prepare received information before passing it to the LinkLayer 1010.

Physical block 1022 includes a transmitter and a receiver. Thetransmitter is supplied by logical sub-block 1021 with symbols, whichthe transmitter serializes and transmits onto to an external device. Thereceiver is supplied with serialized symbols from an external device andtransforms the received signals into a bit-stream. The bit-stream isde-serialized and supplied to logical sub-block 1021. In one embodiment,an 8b/10b transmission code is employed, where ten-bit symbols aretransmitted/received. Here, special symbols are used to frame a packetwith frames 1023. In addition, in one example, the receiver alsoprovides a symbol clock recovered from the incoming serial stream.

As stated above, although transaction layer 1005, link layer 1010, andphysical layer 1020 are discussed in reference to a specific embodimentof a PCIe protocol stack, a layered protocol stack is not so limited. Infact, any layered protocol may be included/implemented. As an example,an port/interface that is represented as a layered protocol includes:(1) a first layer to assemble packets, i.e. a transaction layer; asecond layer to sequence packets, i.e. a link layer; and a third layerto transmit the packets, i.e. a physical layer. As a specific example, acommon standard interface (CSI) layered protocol is utilized.

Referring next to FIG. 12, an embodiment of a PCIe serial point to pointfabric is illustrated. Although an embodiment of a PCIe serialpoint-to-point link is illustrated, a serial point-to-point link is notso limited, as it includes any transmission path for transmitting serialdata. In the embodiment shown, a basic PCIe link includes two,low-voltage, differentially driven signal pairs: a transmit pair1206/1211 and a receive pair 1212/1207. Accordingly, device 1205includes transmission logic 1206 to transmit data to device 1210 andreceiving logic 1207 to receive data from device 1210. In other words,two transmitting paths, i.e. paths 1216 and 1217, and two receivingpaths, i.e. paths 1218 and 1219, are included in a PCIe link.

A transmission path refers to any path for transmitting data, such as atransmission line, a copper line, an optical line, a wirelesscommunication channel, an infrared communication link, or othercommunication path. A connection between two devices, such as device1205 and device 1210, is referred to as a link, such as link 415. A linkmay support one lane—each lane representing a set of differential signalpairs (one pair for transmission, one pair for reception). To scalebandwidth, a link may aggregate multiple lanes denoted by xN, where N isany supported Link width, such as 1, 2, 4, 8, 12, 16, 32, 64, or wider.

A differential pair refers to two transmission paths, such as lines 416and 417, to transmit differential signals. As an example, when line 416toggles from a low voltage level to a high voltage level, i.e. a risingedge, line 417 drives from a high logic level to a low logic level, i.e.a falling edge. Differential signals potentially demonstrate betterelectrical characteristics, such as better signal integrity, i.e.cross-coupling, voltage overshoot/undershoot, ringing, etc. This allowsfor better timing window, which enables faster transmission frequencies.

Turning to FIG. 13, a block diagram of an exemplary computer systemformed with a processor that includes execution units to execute aninstruction, where one or more of the interconnects implement one ormore features in accordance with one embodiment of the presentdisclosure is illustrated. System 1300 includes a component, such as aprocessor 1302 to employ execution units including logic to performalgorithms for process data, in accordance with the present disclosure,such as in the embodiment described herein. System 1300 isrepresentative of processing systems based on the PENTIUM III™, PENTIUM4™ Xeon™, Itanium, XScale™ and/or StrongARM™ microprocessors availablefrom Intel Corporation of Santa Clara, Calif., although other systems(including PCs having other microprocessors, engineering workstations,set-top boxes and the like) may also be used. In one embodiment, samplesystem 1300 executes a version of the WINDOWS™ operating systemavailable from Microsoft Corporation of Redmond, Wash., although otheroperating systems (UNIX and Linux for example), embedded software,and/or graphical user interfaces, may also be used. Thus, embodiments ofthe present disclosure are not limited to any specific combination ofhardware circuitry and software.

Embodiments are not limited to computer systems. Alternative embodimentsof the present disclosure can be used in other devices such as handhelddevices and embedded applications. Some examples of handheld devicesinclude cellular phones, Internet Protocol devices, digital cameras,personal digital assistants (PDAs), and handheld PCs. Embeddedapplications can include a micro controller, a digital signal processor(DSP), system on a chip, network computers (NetPC), set-top boxes,network hubs, wide area network (WAN) switches, or any other system thatcan perform one or more instructions in accordance with at least oneembodiment.

In this illustrated embodiment, processor 1302 includes one or moreexecution units 1308 to implement an algorithm that is to perform atleast one instruction. One embodiment may be described in the context ofa single processor desktop or server system, but alternative embodimentsmay be included in a multiprocessor system. System 1300 is an example ofa ‘hub’ system architecture. The computer system 1300 includes aprocessor 1302 to process data signals. The processor 1302, as oneillustrative example, includes a complex instruction set computer (CISC)microprocessor, a reduced instruction set computing (RISC)microprocessor, a very long instruction word (VLIW) microprocessor, aprocessor implementing a combination of instruction sets, or any otherprocessor device, such as a digital signal processor, for example. Theprocessor 1302 is coupled to a processor bus 1310 that transmits datasignals between the processor 1302 and other components in the system1300. The elements of system 1300 (e.g. graphics accelerator 1312,memory controller hub 1316, memory 1320, I/O controller hub 1324,wireless transceiver 1326, Flash BIOS 1328, Network controller 1334,Audio controller 1336, Serial expansion port 1338, I/O controller 1340,etc.) perform their conventional functions that are well known to thosefamiliar with the art.

In one embodiment, the processor 1302 includes a Level 1 (L1) internalcache memory 1304. Depending on the architecture, the processor 1302 mayhave a single internal cache or multiple levels of internal caches.Other embodiments include a combination of both internal and externalcaches depending on the particular implementation and needs. Registerfile 1306 is to store different types of data in various registersincluding integer registers, floating point registers, vector registers,banked registers, shadow registers, checkpoint registers, statusregisters, and instruction pointer register.

Execution unit 1308, including logic to perform integer and floatingpoint operations, also resides in the processor 1302. The processor1302, in one embodiment, includes a microcode (ucode) ROM to storemicrocode, which when executed, is to perform algorithms for certainmacroinstructions or handle complex scenarios. Here, microcode ispotentially updateable to handle logic bugs/fixes for processor 1302.For one embodiment, execution unit 1308 includes logic to handle apacked instruction set 1309. By including the packed instruction set1309 in the instruction set of a general-purpose processor 1302, alongwith associated circuitry to execute the instructions, the operationsused by many multimedia applications may be performed using packed datain a general-purpose processor 1302. Thus, many multimedia applicationsare accelerated and executed more efficiently by using the full width ofa processor's data bus for performing operations on packed data. Thispotentially eliminates the need to transfer smaller units of data acrossthe processor's data bus to perform one or more operations, one dataelement at a time.

Alternate embodiments of an execution unit 1308 may also be used inmicro controllers, embedded processors, graphics devices, DSPs, andother types of logic circuits. System 1300 includes a memory 1320.Memory 1320 includes a dynamic random access memory (DRAM) device, astatic random access memory (SRAM) device, flash memory device, or othermemory device. Memory 1320 stores instructions and/or data representedby data signals that are to be executed by the processor 1302.

Note that any of the aforementioned features or aspects of thedisclosure may be utilized on one or more interconnect illustrated inFIG. 13. For example, an on-die interconnect (ODI), which is not shown,for coupling internal units of processor 1302 implements one or moreaspects of the disclosure described above. Or the disclosure isassociated with a processor bus 1310 (e.g. Intel Quick Path Interconnect(QPI) or other known high performance computing interconnect), a highbandwidth memory path 1318 to memory 1320, a point-to-point link tographics accelerator 1312 (e.g. a Peripheral Component Interconnectexpress (PCIe) compliant fabric), a controller hub interconnect 1322, anI/O or other interconnect (e.g. USB, PCI, PCIe) for coupling the otherillustrated components. Some examples of such components include theaudio controller 1336, firmware hub (flash BIOS) 1328, wirelesstransceiver 1326, data storage 1324, legacy I/O controller 1310containing user input and keyboard interfaces 1342, a serial expansionport 1338 such as Universal Serial Bus (USB), and a network controller1334. The data storage device 1324 can comprise a hard disk drive, afloppy disk drive, a CD-ROM device, a flash memory device, or other massstorage device.

Referring now to FIG. 14, shown is a block diagram of a second system1400 in accordance with an embodiment of the present disclosure. Asshown in FIG. 14, multiprocessor system 1400 is a point-to-pointinterconnect system, and includes a first processor 1470 and a secondprocessor 1480 coupled via a point-to-point interconnect 1450. Each ofprocessors 1470 and 1480 may be some version of a processor. In oneembodiment, 1452 and 1454 are part of a serial, point-to-point coherentinterconnect fabric, such as Intel's Quick Path Interconnect (QPI)architecture. As a result, the disclosure may be implemented within theQPI architecture.

While shown with only two processors 1470, 1480, it is to be understoodthat the scope of the present disclosure is not so limited. In otherembodiments, one or more additional processors may be present in a givenprocessor.

Processors 1470 and 1480 are shown including integrated memorycontroller units 1472 and 1482, respectively. Processor 1470 alsoincludes as part of its bus controller units point-to-point (P-P)interfaces 1476 and 1478; similarly, second processor 1480 includes P-Pinterfaces 1486 and 1488. Processors 1470, 1480 may exchange informationvia a point-to-point (P-P) interface 1450 using P-P interface circuits1478, 1488. As shown in FIG. 14, IMCs 1472 and 1482 couple theprocessors to respective memories, namely a memory 1432 and a memory1434, which may be portions of main memory locally attached to therespective processors.

Processors 1470, 1480 each exchange information with a chipset 1490 viaindividual P-P interfaces 1452, 1454 using point to point interfacecircuits 1476, 1494, 1486, 1498. Chipset 1490 also exchanges informationwith a high-performance graphics circuit 1438 via an interface circuit1492 along a high-performance graphics interconnect 1439.

A shared cache (not shown) may be included in either processor oroutside of both processors; yet connected with the processors via P-Pinterconnect, such that either or both processors' local cacheinformation may be stored in the shared cache if a processor is placedinto a low power mode.

Chipset 1490 may be coupled to a first bus 1416 via an interface 1496.In one embodiment, first bus 1416 may be a Peripheral ComponentInterconnect (PCI) bus, or a bus such as a PCI Express bus or anotherthird generation I/O interconnect bus, although the scope of the presentdisclosure is not so limited.

As shown in FIG. 14, various I/O devices 1414 are coupled to first bus1416, along with a bus bridge 1418 which couples first bus 1416 to asecond bus 1420. In one embodiment, second bus 1420 includes a low pincount (LPC) bus. Various devices are coupled to second bus 1420including, for example, a keyboard and/or mouse 1422, communicationdevices 1427 and a storage unit 1428 such as a disk drive or other massstorage device which often includes instructions/code and data 1430, inone embodiment. Further, an audio I/O 1424 is shown coupled to secondbus 1420. Note that other architectures are possible, where the includedcomponents and interconnect architectures vary. For example, instead ofthe point-to-point architecture of FIG. 14, a system may implement amulti-drop bus or other such architecture.

Turning to the diagram 1500 of FIG. 15, an example link training statemachine is shown, such as the PCIe link training and status statemachine (LTSSM). For a system utilizing a PHY according to a particularprotocol to support multiple alternative protocols (i.e., to run on topof the PHY), ordered sets may be defined that are to be communicatedbetween two or more devices on a link in connection with the training ofthe link. For instance, training set (TS) ordered sets (OSes) may besent. In an implementation utilizing PCIe as the PHY protocol, the TSordered sets may include a TS1 and a TS2 ordered set, among otherexample ordered sets. The ordered sets and training sequences sentduring link training may be based on the particular link training state,with various link training states utilized to accomplish correspondinglink training activities and objectives.

In one example, such as illustrated in FIG. 15, a link training statemachine 1600 may include such states as a Reset state, a Detect state(e.g., to detect a far end termination (e.g., another device connectedto the lanes), a Polling state (e.g., to establish symbol lock andconfigure lane polarity), a Configuration (or “Config”) state (e.g., toconfigure the physical lanes of a connection into a link with particularlane width, lane numbering, etc., performing lane-to-lane deskew andother link configuration activities), a Loopback state (e.g., to performtesting, fault isolation, equalization, and other tasks), a Recoverystate (e.g., for use to change the data rate of operation, re-establishbit lock, Symbol lock or block alignment, perform lane-to-lane de-skew,etc.) among other states, which may be utilized to bring the link to anactive link state (e.g., L0). In one example, training sequences to besent in a particular one (or more) of the link training states may bedefined to accommodate the negotiation of a particular one of thesupported protocols of a particular device. For instance, the particulartraining state may be a training state preceding entry into an activelink state, or a training state in which the data rate may be upscaled(e.g., beyond that supported by at least one of the supportedprotocols), such as a PCIe state where a data rate transitions from aGen1 speed to Gen3 and higher speeds, among other examples. Forinstance, in the example implementation shown in FIG. 15, aconfiguration state (e.g., 1505) may be utilized and augmented to allownegotiation of a particular one of multiple protocols in parallel withthe link training activities defined natively in the training state(e.g., lane width determination, lane numbering, deskew, equalization,etc.). For instance, particular training sequences may be defined forthe training state and these training sequences may be augmented toallow information to be communicated (e.g., in one or more fields orsymbols of the ordered set) to identify whether each device on the linksupports multiple protocols (e.g., at least one protocol stack otherthan the protocol stack of the physical layer and the corresponding linktraining state machine), identify the particular protocols each devicesupports, and agree upon one or more protocols to employ over theparticular PHY (e.g., through a handshake accomplished through thetransmission of these training sequences across the link (in both theupstream and downstream directions)).

In one example, a PCIe physical layer may be utilized to supportmultiple different protocols. Accordingly, a particular training statein a PCIe LTSSM may be utilized for the negotiation of protocols betweendevices on a link. As noted above, the protocol determination may occureven before the link trains to an active state (e.g., L0) in the lowestsupported data rate (e.g., the PCIe Gen 1 data rate). In one example,the PCIe Config state may be used. Indeed, the PCIe LTSSM may be used tonegotiate the protocol by using modified PCIe Training Sets (e.g., TS1and TS2) after the link width negotiation and (at least partially) inparallel with lane numbering performed during the Config state.

While this disclosure has been described with respect to a limitednumber of embodiments, those skilled in the art will appreciate numerousmodifications and variations therefrom. It is intended that the appendedclaims cover all such modifications and variations as fall within thetrue spirit and scope of this present disclosure.

A design may go through various stages, from creation to simulation tofabrication. Data representing a design may represent the design in anumber of manners. First, as is useful in simulations, the hardware maybe represented using a hardware description language or anotherfunctional description language. Additionally, a circuit level modelwith logic and/or transistor gates may be produced at some stages of thedesign process. Furthermore, most designs, at some stage, reach a levelof data representing the physical placement of various devices in thehardware model. In the case where conventional semiconductor fabricationtechniques are used, the data representing the hardware model may be thedata specifying the presence or absence of various features on differentmask layers for masks used to produce the integrated circuit. In anyrepresentation of the design, the data may be stored in any form of amachine readable medium. A memory or a magnetic or optical storage suchas a disc may be the machine readable medium to store informationtransmitted via optical or electrical wave modulated or otherwisegenerated to transmit such information. When an electrical carrier waveindicating or carrying the code or design is transmitted, to the extentthat copying, buffering, or re-transmission of the electrical signal isperformed, a new copy is made. Thus, a communication provider or anetwork provider may store on a tangible, machine-readable medium, atleast temporarily, an article, such as information encoded into acarrier wave, embodying techniques of embodiments of the presentdisclosure.

A module as used herein refers to any combination of hardware, software,and/or firmware. As an example, a module includes hardware, such as amicro-controller, associated with a non-transitory medium to store codeadapted to be executed by the micro-controller. Therefore, reference toa module, in one embodiment, refers to the hardware, which isspecifically configured to recognize and/or execute the code to be heldon a non-transitory medium. Furthermore, in another embodiment, use of amodule refers to the non-transitory medium including the code, which isspecifically adapted to be executed by the microcontroller to performpredetermined operations. And as can be inferred, in yet anotherembodiment, the term module (in this example) may refer to thecombination of the microcontroller and the non-transitory medium. Oftenmodule boundaries that are illustrated as separate commonly vary andpotentially overlap. For example, a first and a second module may sharehardware, software, firmware, or a combination thereof, whilepotentially retaining some independent hardware, software, or firmware.In one embodiment, use of the term logic includes hardware, such astransistors, registers, or other hardware, such as programmable logicdevices.

Use of the phrase “to” or “configured to,” in one embodiment, refers toarranging, putting together, manufacturing, offering to sell, importingand/or designing an apparatus, hardware, logic, or element to perform adesignated or determined task. In this example, an apparatus or elementthereof that is not operating is still ‘configured to’ perform adesignated task if it is designed, coupled, and/or interconnected toperform said designated task. As a purely illustrative example, a logicgate may provide a 0 or a 1 during operation. But a logic gate‘configured to’ provide an enable signal to a clock does not includeevery potential logic gate that may provide a 1 or 0. Instead, the logicgate is one coupled in some manner that during operation the 1 or 0output is to enable the clock. Note once again that use of the term‘configured to’ does not require operation, but instead focus on thelatent state of an apparatus, hardware, and/or element, where in thelatent state the apparatus, hardware, and/or element is designed toperform a particular task when the apparatus, hardware, and/or elementis operating.

Furthermore, use of the phrases ‘capable of/to,’ and or ‘operable to,’in one embodiment, refers to some apparatus, logic, hardware, and/orelement designed in such a way to enable use of the apparatus, logic,hardware, and/or element in a specified manner. Note as above that useof to, capable to, or operable to, in one embodiment, refers to thelatent state of an apparatus, logic, hardware, and/or element, where theapparatus, logic, hardware, and/or element is not operating but isdesigned in such a manner to enable use of an apparatus in a specifiedmanner.

A value, as used herein, includes any known representation of a number,a state, a logical state, or a binary logical state. Often, the use oflogic levels, logic values, or logical values is also referred to as 1'sand 0's, which simply represents binary logic states. For example, a 1refers to a high logic level and 0 refers to a low logic level. In oneembodiment, a storage cell, such as a transistor or flash cell, may becapable of holding a single logical value or multiple logical values.However, other representations of values in computer systems have beenused. For example the decimal number ten may also be represented as abinary value of 1010 and a hexadecimal letter A. Therefore, a valueincludes any representation of information capable of being held in acomputer system.

Moreover, states may be represented by values or portions of values. Asan example, a first value, such as a logical one, may represent adefault or initial state, while a second value, such as a logical zero,may represent a non-default state. In addition, the terms reset and set,in one embodiment, refer to a default and an updated value or state,respectively. For example, a default value potentially includes a highlogical value, i.e. reset, while an updated value potentially includes alow logical value, i.e. set. Note that any combination of values may beutilized to represent any number of states.

The embodiments of methods, hardware, software, firmware or code setforth above may be implemented via instructions or code stored on amachine-accessible, machine readable, computer accessible, or computerreadable medium which are executable by a processing element. Anon-transitory machine-accessible/readable medium includes any mechanismthat provides (i.e., stores and/or transmits) information in a formreadable by a machine, such as a computer or electronic system. Forexample, a non-transitory machine-accessible medium includesrandom-access memory (RAM), such as static RAM (SRAM) or dynamic RAM(DRAM); ROM; magnetic or optical storage medium; flash memory devices;electrical storage devices; optical storage devices; acoustical storagedevices; other form of storage devices for holding information receivedfrom transitory (propagated) signals (e.g., carrier waves, infraredsignals, digital signals); etc., which are to be distinguished from thenon-transitory mediums that may receive information there from.

Instructions used to program logic to perform embodiments of thedisclosure may be stored within a memory in the system, such as DRAM,cache, flash memory, or other storage. Furthermore, the instructions canbe distributed via a network or by way of other computer readable media.Thus a machine-readable medium may include any mechanism for storing ortransmitting information in a form readable by a machine (e.g., acomputer), but is not limited to, floppy diskettes, optical disks,Compact Disc, Read-Only Memory (CD-ROMs), and magneto-optical disks,Read-Only Memory (ROMs), Random Access Memory (RAM), ErasableProgrammable Read-Only Memory (EPROM), Electrically ErasableProgrammable Read-Only Memory (EEPROM), magnetic or optical cards, flashmemory, or a tangible, machine-readable storage used in the transmissionof information over the Internet via electrical, optical, acoustical orother forms of propagated signals (e.g., carrier waves, infraredsignals, digital signals, etc.). Accordingly, the computer-readablemedium includes any type of tangible machine-readable medium suitablefor storing or transmitting electronic instructions or information in aform readable by a machine (e.g., a computer).

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the present disclosure. Thus, theappearances of the phrases “in one embodiment” or “in an embodiment” invarious places throughout this specification are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments.

In the foregoing specification, a detailed description has been givenwith reference to specific exemplary embodiments. It will, however, beevident that various modifications and changes may be made theretowithout departing from the broader spirit and scope of the disclosure asset forth in the appended claims. The specification and drawings are,accordingly, to be regarded in an illustrative sense rather than arestrictive sense. Furthermore, the foregoing use of embodiment andother exemplarily language does not necessarily refer to the sameembodiment or the same example, but may refer to different and distinctembodiments, as well as potentially the same embodiment.

The systems, methods, and apparatuses can include one or a combinationof the following examples:

Example 1 an apparatus comprising a hardware processor; a port tointerface with a multilane link; and arbitration logic implemented atleast partially in hardware. The arbitration logic to maintain a firstvirtual link state associated with a first interconnect protocol;maintain a second virtual link state associated with a secondinterconnect protocol; receive, from across the multilane link, aphysical layer packet indicating a request to change a state of thefirst virtual link state; determine that the first interconnect protocolis ready to change a physical link state; and change the first virtuallink state according to the physical layer packet while maintaining thesecond virtual link state.

Example 2 may include the subject matter of example 1, the arbitrationlogic to transmit across the multilane link a physical layer packetindicating that the first protocol has changed the first virtual linkstate.

Example 3 may include the subject matter of any of examples 1-2, thearbitration logic to receive, from across the multilane link, a physicallayer packet indicating a request to change a state of the secondvirtual link state; determine that the second interconnect protocol isready to change the second virtual link state; and change the secondvirtual link state according to the physical layer packet whilemaintaining the third virtual link state.

Example 4 may include the subject matter of example 3, the arbitrationlogic to transmit across the multilane link a physical layer packetindicating that the second protocol has changed the second virtual linkstate.

Example 5 may include the subject matter of any of examples 1-4, thearbitration logic to maintain a third virtual link state associated withthe arbitration logic; receive, from across the multilane link, aphysical layer packet indicating a request to change a state of thethird virtual link state; determine that the arbitration logic is readyto change the third virtual link state; and change the third virtuallink state according to the physical layer packet.

Example 6 may include the subject matter of example 5, the arbitrationlogic to transmit across the multilane link a physical layer packetindicating that the arbitration logic has changed the third virtual linkstate.

Example 7 may include the subject matter of any of examples 1-6, theapparatus to maintain a physical link state of the multilane link; andto change the physical link state after each virtual link state has beenchanged.

Example 8 may include the subject matter of any of examples 1-7, whereinthe arbitration logic comprises arbitration and multiplexing circuitry.

Example 9 may include the subject matter of any of examples 1-8, whereinone of the interconnect protocols comprises a protocol based on aPeripheral Component Interconnect Express (PCIe) protocol.

Example 10 may include the subject matter of any of examples 1-9,wherein the multilane link comprises a link based on a Rosetta Linkinterconnect.

Example 11 is a method performed by an arbitration logic, the methodcomprising receiving an indication on a physical layer packet to changea first virtual link state, the first virtual link state associated witha first interconnect protocol; determining that the first interconnectprotocol is ready to change a physical link state associated with thefirst virtual link state; changing the first virtual link state whilemaintaining a second virtual link state associated with a secondinterconnect protocol; and transmitting a physical layer packet acrossthe multilane link indicating a change to the first link state.

Example 12 may include the subject matter of example 11, furthercomprising receiving an indication on a first physical layer packet tochange the second virtual link state, the second virtual link stateassociated with the second interconnect protocol; determining that thesecond interconnect protocol is ready to change a physical link stateassociated with the second virtual link state; changing the secondvirtual link state; and transmitting a second physical layer packetacross the multilane link indicating a change to the second link state.

Example 13 may include the subject matter of any of examples 11-12,further comprising receiving an indication on a physical layer packet tochange a third virtual link state, the third virtual link stateassociated with an arbitration logic; determining that the arbitrationlogic is ready to change a physical link state associated with the thirdvirtual link state; changing the third virtual link state; transmittinga physical layer packet across the multilane link indicating a change tothe third link state; and changing a physical link state associated withthe multilane link.

Example 14 may include the subject matter of example 13, furthercomprising changing a physical link state of the multilane link based onchanges to the first, second, and third virtual link states.

Example 15 may include the subject matter of any of 11-14, wherein oneof the first or second interconnect protocols comprises a protocol basedon a Peripheral Component Interconnect Express (PCIe) protocol.

Example 16 may include the subject matter of any of examples 11-15,wherein the first physical layer packet comprises a state requestmessage and wherein the second physical layer packet comprises a statestatus message.

Example 17 may include the subject matter of any of examples 11-16,wherein the multilane link comprises a link that connects two dies of amultichip device.

Example 18 is a system comprising a first die comprising a firstarbitration and multiplexing logic, a first protocol stack associatedwith a first interconnect protocol, and a second protocol stackassociated with a second interconnect protocol. The system also includesa second die comprising a second arbitration and multiplexing logic; anda multilane link connecting the first die to the second die. The secondarbitration and multiplexing logic is to send a request to the firstarbitration and multiplexing logic to change a first virtual link stateassociated with the first protocol stack. The first arbitration andmultiplexing logic is to receive, from across the multilane link, therequest from the first die indicating a request to change the firstvirtual link state; determine that the first interconnect protocol isready to change a physical link state; and change the first virtual linkstate according to the received request while maintaining a secondvirtual link state.

Example 19 may include the subject matter of example 18, the firstarbitration and multiplexing logic to transmit across the multilane linka physical layer packet indicating a change in the first virtual linkstate.

Example 20 may include the subject matter of any of examples 18-19, thesecond arbitration and multiplexing logic to receive the physical layerpacket indicating the change in the first virtual link state, and todetermine that a first virtual link state associated with a firstprotocol stack at the second die is ready to change a physical linkstate; and change a first virtual link state for the first protocolstack at the second die.

Example 21 may include the subject matter of any of examples 18-20, thefirst arbitration and multiplexing logic to receive, from across themultilane link, a physical layer packet indicating a request to change astate of the second virtual link state; determine that the secondinterconnect protocol is ready to change a physical link state; andchange the second virtual link state according to the physical layerpacket while maintaining the third virtual link state.

Example 22 may include the subject matter of example 21, the firstarbitration and multiplexing logic to transmit across the multilane linka physical layer packet indicating that the second protocol has changedthe second virtual link state.

Example 23 may include the subject matter of any of 18-22, the firstarbitration and multiplexing logic to maintain a third virtual linkstate associated with the first arbitration and multiplexing logic;receive, from across the multilane link, a physical layer packetindicating a request to change a state of the third virtual link state;determine that the first arbitration and multiplexing logic is ready tochange a physical link state; and change the third virtual link stateaccording to the physical layer packet.

Example 24 may include the subject matter of example 23, the firstarbitration and multiplexing logic to transmit across the multilane linka physical layer packet indicating that the first arbitration andmultiplexing logic has changed the third virtual link state.

Example 25 may include the subject matter of any of examples 18-24,wherein the first protocol stack comprises transaction layer and linklayer protocols for a Peripheral Component Interconnect Express(PCIe)-based protocol.

Example 26 a machine readable medium including code, when executed, tocause a machine to receiving an indication on a physical layer packet tochange a first virtual link state, the first virtual link stateassociated with a first interconnect protocol; determining that thefirst interconnect protocol is ready to change a physical link stateassociated with the first virtual link state; changing the first virtuallink state while maintaining a second virtual link state associated witha second interconnect protocol; and transmitting a physical layer packetacross the multilane link indicating a change to the first link state.

Example 27 may include the subject matter of example 26, furthercomprising receiving an indication on a first physical layer packet tochange the second virtual link state, the second virtual link stateassociated with the second interconnect protocol; determining that thesecond interconnect protocol is ready to change a physical link stateassociated with the second virtual link state; changing the secondvirtual link state; and transmitting a second physical layer packetacross the multilane link indicating a change to the second link state.

Example 28 may include the subject matter of any of examples 26-27,further comprising receiving an indication on a physical layer packet tochange a third virtual link state, the third virtual link stateassociated with an arbitration logic; determining that the arbitrationlogic is ready to change a physical link state associated with the thirdvirtual link state; changing the third virtual link state; transmittinga physical layer packet across the multilane link indicating a change tothe third link state; and changing a physical link state associated withthe multilane link.

Example 29 may include the subject matter of example 28, furthercomprising changing a physical link state of the multilane link based onchanges to the first, second, and third virtual link states.

Example 30 may include the subject matter of any of 26-29, wherein oneof the first or second interconnect protocols comprises a protocol basedon a Peripheral Component Interconnect Express (PCIe) protocol.

Example 31 may include the subject matter of any of examples 26-30,wherein the first physical layer packet comprises a state requestmessage and wherein the second physical layer packet comprises a statestatus message.

Example 32 may include the subject matter of any of examples 26-31,wherein the multilane link comprises a link that connects two dies of amultichip device.

Example 33 is an apparatus comprising a means for maintaining a firstvirtual link state associated with a first interconnect protocol; meansfor maintaining a second virtual link state associated with a secondinterconnect protocol; means for receiving, from across the multilanelink, a physical layer packet indicating a request to change a state ofthe first virtual link state; means for determining that the firstinterconnect protocol is ready to change a physical link state; andmeans for changing the first virtual link state according to thephysical layer packet while maintaining the second virtual link state

What is claimed is:
 1. An apparatus comprising: physical layer circuitry(PHY) to: receive, from across a link, a physical layer packetindicating a request to change a state of a first virtual link stateassociated with a first interconnect protocol; determine that the firstinterconnect protocol is ready to change a physical link state; changethe first virtual link state according to the physical layer packet; andtransmit a physical layer packet across the link to indicate the changein the first virtual link state.
 2. The apparatus of claim 1, the PHY tosend across the link a physical layer packet indicating that the firstprotocol has changed the first virtual link state.
 3. The apparatus ofclaim 1, the PHY to: maintain the first virtual link state associatedwith the first interconnect protocol; and maintain a second virtual linkstate associated with a second interconnect protocol.
 4. The apparatusof claim 3, the PHY to: receive, from across the link, a physical layerpacket indicating a request to change a state of the second virtual linkstate; determine that the second interconnect protocol is ready tochange the second virtual link state; and change the second virtual linkstate according to the physical layer packet while maintaining a thirdvirtual link state.
 5. The apparatus of claim 4, the PHY to send acrossthe link a physical layer packet indicating that the second protocol haschanged the second virtual link state.
 6. The apparatus of claim 5, thearbitration logic to transmit across the link a physical layer packetindicating that the arbitration logic has changed the third virtual linkstate.
 7. The apparatus of claim 1, the PHY comprising arbitrationlogic, the PHY to: maintain a second virtual link state associated witharbitration logic; receive, from across the link, a physical layerpacket indicating a request to change a state of the second virtual linkstate; determine that the arbitration logic is ready to change thesecond virtual link state; and change the second virtual link stateaccording to the physical layer packet.
 8. The apparatus of claim 1,wherein the first interconnect protocol is based on a PeripheralComponent Interconnect Express (PCIe) protocol.
 9. The apparatus ofclaim 1, wherein the link comprises a link based on a Rosetta Linkinterconnect.
 10. A method performed by physical layer circuitry (PHY),the method comprising: receiving an indication to change a first virtuallink state for a multilane link, the first virtual link state associatedwith a first interconnect protocol; determining that the firstinterconnect protocol is ready to change a physical link stateassociated with the first virtual link state; changing the first virtuallink state while maintaining a second virtual link state associated witha second interconnect protocol; and sending a message across themultilane link to indicate the change to the first virtual link state.11. The method of claim 10, further comprising: receiving an indicationon a first physical layer packet to change the second virtual linkstate; determining that the second interconnect protocol is ready tochange a physical link state associated with the second virtual linkstate; changing the second virtual link state; and transmitting a secondphysical layer packet across the multilane link indicating a change tothe second link state.
 12. The method of claim 11, further comprising:receiving an indication on a third physical layer packet to change athird virtual link state, the third virtual link state associated withan arbitration logic; determining that the arbitration logic is ready tochange a physical link state associated with the third virtual linkstate; changing the third virtual link state; transmitting a physicallayer packet across the multilane link indicating a change to the thirdlink state; and changing a physical link state associated with themultilane link.
 13. The method of claim 12, further comprising changinga physical link state of the multilane link based on changes to thefirst, second, and third virtual link states.
 14. The method of claim10, wherein one of the first or second interconnect protocols comprisesa protocol based on a Peripheral Component Interconnect Express (PCIe)protocol.
 15. The method of claim 10, wherein the multilane linkcomprises a link that connects two dies of a multichip device.
 16. Asystem comprising: a first die comprising: first physical layercircuitry (PHY), a first protocol stack associated with a firstinterconnect protocol, and a second protocol stack associated with asecond interconnect protocol; a second die comprising a second PHY; anda multilane link connecting the first die to the second die; the secondPHY to send to the first PHY a request to change a first virtual linkstate associated with the first protocol stack; the first PHY to:receive, from across the multilane link, the request from the second dieto change the first virtual link state; determine that the firstinterconnect protocol is ready to change a physical link state; andchange the first virtual link state according to the received requestwhile maintaining a second virtual link state.
 17. The system of claim16, the first PHY to transmit across the multilane link a physical layerpacket to indicate a change in the first virtual link state.
 18. Thesystem of claim 17, the second PHY to receive the physical layer packetthat indicates the change in the first virtual link state, and to:determine that a first virtual link state associated with a firstprotocol stack at the second die is ready to change a physical linkstate; and change a first virtual link state for the first protocolstack at the second die.
 19. The system of claim 16, the first PHY to:receive, from across the multilane link, a physical layer packetcomprising a request to change a state of the second virtual link state;determine that the second interconnect protocol is ready to change aphysical link state; and change the second virtual link state accordingto the physical layer packet while maintaining a third virtual linkstate.
 20. The system of claim 19, the first PHY to send across themultilane link a physical layer packet to indicate that the secondvirtual link state has changed.
 21. The system of claim 16, the firstPHY comprising arbitration logic, the first PHY to: receive, from acrossthe multilane link, a physical layer packet comprising a request tochange a state of a second virtual link state, the second virtual linkstate associated with the arbitration logic; determine that thearbitration logic is ready to change a physical link state; and change athird virtual link state according to the physical layer packet.
 22. Thesystem of claim 21, the first PHY to transmit across the multilane linka physical layer packet indicating that the first PHY has changed thesecond virtual link state.
 23. The system of claim 16, wherein the firstprotocol stack comprises transaction layer and link layer protocols fora Peripheral Component Interconnect Express (PCIe)-based protocol; andwherein the multilane link comprising a link based on an R-linkinterconnect protocol.